ИСТИНА

• Охват: Международная
• Даты проведения: 15-17 октября 2017
• Место проведения: North China University of Technology, China
• Организатор:
  North China University of Technology
• Число участников: 100
• Число участников из МГУ: 1
• Число докладчиков: 19
• Веб-сайт: http://maip.ncut.edu.cn/
• Описание конференции:

  The focus of this Workshop is to discuss challenges of interconnect materials including low- and ultralow-k materials, metallization, packaging, reliability and emerging technologies. The further shrinking of the semiconductor devices requires the introduction of dielectric materials with high porosity and much thinner metallization liners, and addressing the increasing resistivity of Cu with decreasing dimensions. Innovation in development of new materials, processes, and architectures are needed to address these problems and to maintain the reliability of interconnects. This Workshop is a forum for researchers to exchange the latest advances in materials, processes, integration, and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies.

• Добавил в систему: Зырянов Сергей Михайлович

Доклады:

• 2017 Challenges of plasma processing of organisilicate based low-k materials (Приглашенный)
• Автор: Sergey Zyryanov