Grain boundary phase transformation in Cu–Co solid solutionsстатья
Статья опубликована в высокорейтинговом журнале
Информация о цитировании статьи получена из
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Статья опубликована в журнале из списка Web of Science и/или Scopus
Дата последнего поиска статьи во внешних источниках: 7 декабря 2017 г.
Аннотация:The present work examined the creep behavior of copper based solid solutions with cobalt at temperatures between 980 °C and 1080 °C and stresses lower than 0.2 MPa. The samples were made from 18 μm foil and were formed into cylinders. After the pre-annealing at 1000 °C during about 30 h the samples had a parquet structure. The experiments were performed in the hydrogen atmosphere. New equipment was designed for these measurements