|
ИСТИНА |
Войти в систему Регистрация |
Интеллектуальная Система Тематического Исследования НАукометрических данных |
||
Mathematical modeling of diffusion-controlled processes of the near-surface layer structure evolution of W-CU composite under high-temperature gas flowстатья
- Авторы: Tokmacheva-Kolobova A.Yu, Tokmachev M.G., Yanovskii L.S., Kolobov Yu R.
- Журнал: Russian Physics Journal
- Том: 65
- Номер: 7
- Год издания: 2022
- Издательство: Springer Nature
- Местоположение издательства: Switzerland
- Первая страница: 1167
- Последняя страница: 1171
- DOI: 10.1007/s11182-022-02746-7
- Аннотация: The article presents the results of mathematical modeling of copper leakage from a 30 μm-thick near-surface layer of the experimental samples of a W–18% Cu composite (VD-MP grade) as a result of exposure to a hightemperature (1500 K) gas flow caused by the diffusion of copper particles located in the bulk and at the tungsten grain boundaries (GBs) along the latter. The grain-boundary diffusion parameters in this composite are evaluated in the temperature range, where the copper particles are in a liquid state. Using the known experimental data, the value of the high-temperature coefficient of grain-boundary copper diffusion in the polycrystalline tungsten matrix of the composite is calculated within the framework of the constructed computer model. The value of the obtained coefficient D = 7·10–10 m2/s is found to be close to that for diffusion in liquid copper.
- Добавил в систему: Токмачев Михаил Геннадьевич