Аннотация:In the last decade, Photonics Technology has been an emerging technology for optical telecommunications and for optical interconnects in microelectronics. As a result, a large diversity of Photonics design methodologies has merged with very challenging scales and shapes. Manufacturing such curvy and critical photonics shapes requires advanced Resolution Enhancement Techniques (RET) including Inverse Lithography Techniques (ILT) with 193nm immersion lithography. In this paper, we investigate the manufacturing challenges of several Photonics devices using advanced ILT solutions and the SRAF insertion impact on delivering good litho quality including EPE, PVband and LER.