Место издания:Materials Science International Services GmbH Stuttgart (Federal Republic of Germany)
Первая страница:435
Последняя страница:444
Аннотация:The Cu-Pd-Sn system gained interest in the search for new lead free solders because the performance of Pd-coated components with lead-free alloys is equivalent to, or better than PbSn. This is due to the slightly greater dissolution rates of Pd in high tin alloys. Generally, lead-free alloys perform adequately on OSP (Organic Solderability Preservatives) coated boards, but have improved solderability on metallic coatings such as Sn, Ag or Pd.
