Investigation of the Properties of Epoxy Modified Binders Based on Epoxy Oligomer with Improved Deformation and Strength Properties//World Academy of Science, Engineering and Technologyстатья
Дата последнего поиска статьи во внешних источниках: 8 сентября 2021 г.
Аннотация:The process of modification of ed-20 epoxy resin
synthesized by vinyl-containing compounds is considered. It is
shown that the introduction of vinyl-containing compounds into the
composition based on epoxy resin ED-20 allows adjusting the
technological and operational characteristics of the binder. For
improvement of the properties of epoxy resin, following modifiers
were selected: polyvinylformalethyl, polyvinyl butyral and
composition of linear and aromatic amines (Аramine) as a hardener.
Now the big range of hardeners of epoxy resins exists that allows
varying technological properties of compositions, and also
thermophysical and strength indicators. The nature of the aramin type
hardener has a significant impact on the spatial parameters of the
mesh, glass transition temperature, and strength characteristics.
Epoxy composite materials based on ED-20 modified with polyvinyl
butyral were obtained and investigated. It is shown that the
composition of resins based on derivatives of polyvinyl butyral and
ED-20 allows obtaining composite materials with a higher complex
of deformation-strength, adhesion and thermal properties, better
water resistance, frost resistance, chemical resistance, and impact
strength. The magnitude of the effect depends on the chemical
structure, temperature and curing time. In the area of concentrations,
where the effect of composite synergy is appearing, the values of
strength and stiffness significantly exceed the similar parameters of
the individual components of the mixture. The polymer-polymer
compositions form their class of materials with diverse specific
properties that ensure their competitive application. Coatings with
high performance under cyclic loading have been obtained based on
epoxy oligomers modified with vinyl-containing compounds.