Surface-confined Activation of Ultra Low-k Dielectrics in CO2 Plasmaстатья
Статья опубликована в высокорейтинговом журнале
Информация о цитировании статьи получена из
Web of Science
Статья опубликована в журнале из списка Web of Science и/или Scopus
Дата последнего поиска статьи во внешних источниках: 2 декабря 2016 г.
Аннотация:A new method allowing surface-confined activation of porous organosilicate based low-k dielectrics is proposed and studied. It is demonstrated that a short exposure of organosilicate low-k films to CO2 plasma enables high surface hydrophilicity with minimal bulk modification. CO2+ ions preferentially formed in this plasma have high oxidation potential and efficiently remove surface -CH3 groups. At the same time, the CO2+ ions easily discharge (deactivated ) during their collisions with pore walls and therefore have very limited probability of penetration into the low-k bulk. Low concentration of oxygen radicals is another factor minimizing the bulk damage. The chemical reactions describing the interactions between CO2 plasma and low-k dielectric are proposed.