Compilation of 3-D global conductivity model of the Earth for space weather applicationsстатья

Статья опубликована в высокорейтинговом журнале

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Дата последнего поиска статьи во внешних источниках: 17 апреля 2018 г.

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[1] Alekseev D., Kuvshinov A., Palshin N. Compilation of 3-d global conductivity model of the earth for space weather applications // Earth, Planets and Space. — 2015. — Vol. 67, no. 67:108. — P. 1–11. We have compiled a global three-dimensional (3D) conductivity model of the Earth with an ultimate goal to be used for realistic simulation of geomagnetically induced currents (GIC), posing a potential threat to man-made electric systems. Bearing in mind the intrinsic frequency range of the most intense disturbances (magnetospheric substorms) with typical periods ranging from a few minutes to a few hours, the compiled 3D model represents the structure in depth range of 0–100 km, including seawater, sediments, earth crust, and partly the lithosphere/asthenosphere. More explicitly, the model consists of a series of spherical layers, whose vertical and lateral boundaries are established based on available data. To compile a model, global maps of bathymetry, sediment thickness, and upper and lower crust thicknesses as well as lithosphere thickness are utilized. All maps are re-interpolated on a common grid of 0.25 × 0.25 degree lateral spacing. Once the geometry of different structures is specified, each element of the structure is assigned either a certain conductivity value or conductivity versus depth distribution, according to available laboratory data and conversion laws. A numerical formalism developed for compilation of the model, allows for its further refinement by incorporation of regional 3D conductivity distributions inferred from the real electromagnetic data. So far we included into our model four regional conductivity models, available from recent publications, namely, surface conductance model of Russia, and 3D conductivity models of Fennoscandia, Australia, and northwest of the United States. [ DOI ]

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