ИСТИНА

One of the areas of scientific interest is the study of electronic transport across layers in highly anisotropic layered compounds. For the fabrication of structures oriented perpendicular to the layers, the method of 3D micromachining with a focused ion beam has proven itself well. However, the resulting structures are fragile and mechanically unstable when the temperature of the sample changes. In this paper, a brief summary of the methods that allow increasing the stability of stacked junctions in a wide range of temperatures is presented.