Materials for advanced metallisation International workshop, Dresden, Germany, March 26-29, 2017сборник

Статьи, опубликованные в сборнике

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• • 2017 Deep Silicon etching in cryo process for TSV 3D integration
  • Miakonkikh A.V., Rogozhin A.E., Tatarintsev A.A., Gushin O.P., Rudenko K.V., Lukichev V.F.
  • в сборнике Materials for advanced metallisation International workshop, Dresden, Germany, March 26-29, 2017, тезисы